FREMONT, Calif.–(BUSINESS WIRE)– Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, has announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.
These orders cover YES’s comprehensive portfolio of Dry and Wet process systems. The equipment will be used to support panel-level manufacturing on glass substrates, specifically for next-generation data center and HPC packaging.
This development underscores YES’s commitment to advancing semiconductor manufacturing technologies that cater to the growing demands of AI and HPC markets.
http://www.businesswire.com/news/home/20251020459437/en/YES-Selected-to-Deliver-Full-Portfolio-of-Advanced-Packaging-Tools-for-Glass-Panel-AI-and-HPC-Applications-by-a-Leading-AI-Infrastructure-Supplier/?feedref=JjAwJuNHiystnCoBq_hl-Q-tiwWZwkcswR1UZtV7eGe24xL9TZOyQUMS3J72mJlQ7fxFuNFTHSunhvli30RlBNXya2izy9YOgHlBiZQk2LOzmn6JePCpHPCiYGaEx4DL1Rq8pNwkf3AarimpDzQGuQ==
