YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier
FREMONT, Calif.–(BUSINESS WIRE)– #AI–Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, today announced that it has received multiple tool orders from a global leader in AI infrastructure solutions. The orders span YES’s portfolio of Dry and Wet process systems and will support panel-level manufacturing on glass substrates for next-generation data center and HPC packaging. The systems will be dep